Ceramic Bga Package

The bga is descended from the pin grid array pga which is a package with one face covered or partly covered with pins in a grid pattern which in operation conduct electrical signals between the integrated circuit and the printed circuit board pcb on which it is placed.

Ceramic bga package.

Amkor flip chip bga fcbga packages are assembled around state of the art single unit laminate or ceramic substrates. Package outline material information. Ceramic bga packages also work well with flip chips in general. Ball grid array bga ceramic pin grid array pga fineline bga fbga hybrid fineline bga hbga plastic dual in line package pdip plastic enhanced quad flat pack eqfp plastic j lead chip carrier plcc plastic quad flat pack pqfp power quad flat pack rqfp thin quad flat pack tqfp.

32 ball ceramic bga 6 85mm x 6 85mm x 3 8mm bg 32 3 pdf. Ceramic ball grid array package drawings bg view more. Having a very high melting point this type bga requires c4 approach controlled collapse chip connection for making the bridge between bgas and pcbs. Flip chip hitce ltcc bga package kyocera provides both ceramic and organic packages for large scale integration lsi devices.

Ball grid array bga. As the name implies this is ceramic type bga. Cbga ceramic ball grid array. Utilizing multiple high density routing layers laser drilled blind buried and stacked vias and ultra fine line space metallization fcbga substrates have the highest routing density available.

Csp bga chip scale bc ca chip scale package ball grid array package drawings bc ca view more. Available in the following packages. Ceramic ball grid array package drawings bg filter packages by entering lead count or product description into the search box below. An array of bare lands only.

Fcbga flip chip bp flipchip ball grid array package drawings bp view. In a bga the pins are replaced by pads on the bottom of the package each initially with a tiny solder ball stuck to it. Ceramic substrate 10sn 90pb solder balls 63sn 37pb solder ball to substrate attach 97pb 3sn c4 joint 0 89 mm solder ball for 1 27 mm pitch 1 27 mm pitch c4 c. The ration between tin and lead is 10 90 in this type.

Similar to in appearance to qfn but mating is by spring pins within a socket rather than solder. A square or rectangular array of solder balls on one surface ball spacing typically 1 27 mm 0 050 in land grid array lga.