Ceramic Cavity Package

Cupack packages unique design with very low thermal resistance.

Ceramic cavity package.

The flange or heatsink material has evolved over the years and the most commonly used material today is cpc cu mo70cu cu a laminate of copper and coppermolybdenum. The traditional package for rf power transistors is the air cavity package with a ceramic lid. Ceramic pin grid array packages cpga cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. Ceramic air cavity packages proven performance for wireless applications.

Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom. Packages are available in surface mount designs as well as bolt down versions in dozens of open tooled designs. Hermetic or vacuum sealing is typically applied to ensure device quality. Ca pack packages convenient pre assembled ceramic package.

Air cavity type hermetic package close thermal expansion matching provides superior mechanical elasticity and less mechanical stress with silicon mems chips miniaturized high density surface mountable package incorporating multi layer ceramic technology.