Ceramic Chip Carrier

Solder glass or epoxy seal.

Ceramic chip carrier.

Low profile multilayer ceramic package. The external lead frame is formed into a j shape to allow for socketing or direct board soldering. Chip carriers may be made of ceramic or plastic. Leadless ceramic smt packages and chip carriers with pctf for a direct pcb mount.

Plastic magazine plug family co 022. Some forms of chip carrier package are standardized in dimensions and registered with trade industry associations such as jedec. Clcc ceramic leadless chip carrier mm inch unit. The leadless chip carrier s low profile multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and bottom of the package.

Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no. Ceramic leaded chip carrier cqfj the ceramic quad flat pack continues to be popular in various surface mount applications. Ceramic chip carrier cerquad family 68 lead ceramic leaded cl chip carrier with window square cerquad. Carrier outlines co family registration no.

Fully hermetic smt package. Footprint compatible with cqjb and plcc. Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below. Tapepak plug family coinstack magazine.

Gold or solder dip. Ceramic leadless chip carrier lcc jedec type leadless chip carriers continue their popularity for surface mount applications. Ceramic chip carrier. Socket or surface mount package.

17 84 lead ceramic leaded cl chip carrier with window square cerquad. Commercial quasi hermetic smt package. Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications. 18 small outline transistor family.

Leadless smt packages and chip carriers design concept is based on creating an interconnect pattern on a ceramic substrate with pctf plated copper on thick film technology for multiple or. Castellations instead external leads. Other forms are proprietary. 12 lead lcc 2 9mm x 2 9mm w ep e 12 4 pdf.

I updated 10 05 ceramic chip carrier magazine type a b and d 68 pin leadless co 006. Chip carriers can be smaller than dual in line packages and since they use all four edges of the package they can have a larger pin count. 1st 2nd 3rd total seal ring die attach a x b c x d e x. Variety of body sizes.

Tapepak magazine family metal coinstack co 019. Plastic magazine family coinstack co 021.