Materials plating and manufacture introduction the printed circuit board has become well known even to those who have no formal knowledge of electronics.
Ceramic hybrid circuit.
After drying and sintering a layer this process can be repeated several times.
In electronics manufacturing thick film technology is used to manufacture multilayer printed circuit boards and hybrid circuits.
Hybrid circuit a hybrid circuit is a miniaturized electronic circuit constructed of individual devices such as transistors diodes and passive components such as resistors inductors and capacitors the resistors in a hybrid circuit can be printed on the ceramic substrate using resistive paste that is fired at high temperature to desired value.
The conductor paths are screen printed directly onto ceramic substrates aluminium substrates or glass substrates.
A hybrid integrated circuit hic hybrid microcircuit hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices such as semiconductor devices e g.
The ceramic circuit material is then processed per the requirements of each job.
A lesser known but firmly entrenched and growing method of circuit manufacture uses ceramic hybrid microelectronics technology.
Electronic circuit carriers made from advanced ceramic materials rubalit and alunit engineered by ceramtec have earned a reputation worldwide as the standard materials for electronic circuit carriers and their quality is acknowledged by every brand name manufacturer of hybrid circuits.
In this process circuit wiring is printed.
Hybrid circuit manufacturing process.
The base material is custom ordered including composition size and hole placements required for each job.