Ceramic Leadless Chip Carrier Socket

Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.

Ceramic leadless chip carrier socket.

A plastic leaded chip carrier plcc has a rectangular plastic housing it is a reduced cost evolution of the ceramic leadless chip carrier clcc. Leadless chip carriers are ideal for surface mount applications. Leadless chip carrier sockets conform to jedec standards a b c and d. Solder glass or epoxy seal.

A socket for a leadless chip carrier said socket including a base member having a central opening therein a plurality of conductive resilient contacts for engaging conductive pads on said carrier each contact anchored in said base member and including an upwardly extending part said contacts positioned on at least two side edges of said base member opening and constituting opposing. The chip is held into the socket by friction. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact. Heat sinks also available in six sizes.

A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package. 28 44 52 68 84 and 124. Footprint compatible with cqjb and plcc. Castellations instead external leads.

Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Surface mount and soldertail options are available. Variety of body sizes. Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc.

28 44 52 68 84 and 124. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in. A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package.

Leadless chip carrier sockets. A premolded plcc was originally released in 1976 but did not see much market adoption. Socket or surface mount package. Leadless chip carrier sockets conform to jedec standards a b c and d.

Gold or solder dip. Surface mount and soldertail options are available. Contact is primarily made on the sides of the package not the bottom in order to take advantage of the wiping action. Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact force with the socket.