Ceramic Hybrid Ic Packaging

At the same time the vacuum tight housings and substrates must.

Ceramic hybrid ic packaging.

Packaging and electronic assembly criteria labs offers a full array of ic packaging services from wafer dicing to assembly of gaas gan rf modules and high temperature mcm s. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition. A hybrid integrated circuit hic hybrid microcircuit hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices such as semiconductor devices e g. A multi chip module mcm is generically an electronic assembly such as a package with a number of conductor terminals or pins where multiple integrated circuits ics or chips semiconductor dies and or other discrete components are integrated usually onto a unifying substrate so that in use it can be treated as if it were a larger ic.

Mechanical integrity provided by using shoulder pins. Transistors diodes or monolithic ics and passive components e g. Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Twenty mil thick ultra.

0 100 double row edge pinout. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Circular and slotted holes allow mechanical positioning. Co 2 lasered ceramic with matching window frame.

Other terms such as hybrid or hybrid. The package is a case that surrounds the circuit material to protect it from corrosion or physical damage and to allow for mounting of the electrical contacts connecting it to the pcb. Ic or integrated circuit packaging refers literally to the material that contains a semiconductor device. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance.

Plated holes enabling multiple conductor levels.